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Point1
銅箔厚の最適化で大電流対策
必要な電流値に対し必要な線幅を確保できない場合、銅箔厚を厚くする方法があります。図のように銅箔厚35μを倍の70μにすると電流も理論上2倍流れるようになります。一般的に70μ以上になると、厚銅基板として扱いコストも上がります。
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Point2
複数層にすることで大電流対策
必要な電流値に対し必要な線幅を確保できない場合、層数を増やす方法があります。上図のように層数を増やして対応します。
この場合インピーダンスをある程度一定にするため、パターン上にビアを設けるほうが放熱的にも効果的です。
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Point3
銅箔厚と層数の変更により大電流対策
必要な電流値に対し必要な線幅を確保できない場合、 Point1,2の複合的な対策を行う場合もあります。
層数を増やし（図では4層）銅箔厚を増やすことで、必要な面積で銅箔厚にもよりますが、4倍にも6倍にも大電流を流すことが可能になります。
但し、パターンが層間で重なるので発熱の問題が発生しますので、発熱対策を施すことが重要止まります。
